Global Foundries, Santa Clara, Calif., introduces an optimized semiconductor manufacturing platform aimed specifically at meeting the stringent and evolving needs of the automotive industry.
Peregrine Semiconductor Corp., San Diego, has shipped the first RF switches built on the UltraCMOS 10 technology platform.
Indium Corp., Utica, N.Y., has developed SACm, a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling.
Applied Materials Inc., has developed its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.
Finetech, Gilbert, Ariz., has been selected by the Georgia Tech Packaging Research Center (PRC), Atlanta, to provide its semi-automatic Matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine-pitch copper interconnect and assembly technology.
