Researchers at Lawrence Berkeley National Laboratory have developed a real-time 3D X-ray imaging technique to observe spacecraft heat shield ablation as it happens, improving how engineers model and design thermal protection systems for space missions.
Rigaku Corporation, Japan, a global solutions partner in X-ray analytical systems, launched the CT Lab HR160, a high-resolution X-ray computed tomography system for battery, semiconductor devices, electronic components, and advanced materials analysis.
TRUMPF, Germany, has developed the first industrial process of its kind using its HiPIMS products to coat microscopic structures in glass substrates, supporting the semiconductor industry in bringing next-generation high-performance AI processors to series production.
Advanced technologies are transforming industry, society, and people’s daily lives. Shelly Zhang, an NSF-supported researcher, discusses her work using additive manufacturing and topology optimization to create new structures, including a 3D thermal cloaking device.
In this video from Applied Materials learn why the industry now needs wafer-fab-class process control in advanced packaging.
