Ultratech Inc., San Jose, Calif., announces a follow-on order from a major foundry for its LSA101 laser spike anneal system equipped with the dual-beam option, which provides a second low-power laser that adds flexibility to chip production.
Samsung Electronics Co. Ltd., Korea, has begun mass producing the industry’s first 10-nm class 8Gb DDR4 (double-data-rate-4) DRAM chips and the modules derived from them.
Invensas Corp., San Jose, Calif., announces that Sandia National Laboratories has signed a new license agreement for ZiBond low-temperature homogeneous bonding technology and for Direct Bond Interconnect (DBI) technology, a low-temperature, hybrid bonding technology for integrated electrical interconnects.
The Electronic System Design (ESD) Alliance, San Jose, Calif., and Semico Research, Phoenix, Ariz., announce that they have entered into a joint marketing agreement to work together on several business initiatives in support of the semiconductor design ecosystem.
Amkor Technology Inc., Tempe, Ariz., announces that it has shipped 700 million RF and front-end advanced system-in-package (SIP) modules for mobile device applications.
