Nikon Instruments Inc., Melville, N.Y., and JEOL, Peabody, Mass., have formed a partnership to research and develop solutions to address correlative light and electron microscopy.
Craic Technologies, San Dimas, Calif., announces Spectral Surface Mapping (S2M) software for its UV-visible-NIR microspectrophotometers.
Electro Scientific Industries Inc., Portland, Maine, announces the µFlex Series multi-axis precision laser micromachining platform.
Applied Materials Inc., Santa Clara, Calif., announces that it has collaborated with Samsung Electronics Co. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.
Imec, Belgium, has announced a joint development project with Coventor, Cary, N.C., that will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to Imec’s 10- and 7-nm processes.
