FEI Co., Hillsboro, Ore., announces the opening of a new technology center in the industrial estate of Cernovická Terasa, Brno, Czech Republic.
FEI opens new technology center in the Czech Republic
Nordson DAGE Launches automated X-ray inspection system
Nordson DAGE, Aylsworth, U.K., a division of Nordson Corp., announces the launch of its Xi3400 Automated X-ray Inspection System (AXI).
A-STAR forms four semiconductor R&D labs with ten partners
A-STAR, Singapore, announces that four joint laboratories, representing a commitment of $160 million between private and public sectors, were launched this summer between the Agency for Science, Technology and Research’s (A*STAR’s) Institute of Microelectronics, and its ten industry partners.
Advantech and Penn State collaborate to simplify fabrication of complex electronic devices
Advantech US Inc., Pittsburgh, reports that its engineers working with Penn State’s Nanofabrication Laboratory have fabricated a prototype mask of silicon etched with the required micrometer-scale features.
FEI’s third-generation Helios DualBeam FIB/SEM adds workflow-specific configuration
FEI Co., Hillsboro, Ore., has released the third generation of its Helios NanoLab DualBeam FIB/SEM microscope, which provides excellent image contrast and resolution, while at the same time adding a an easy-to-use user interface.