Researchers at Penn State have developed a microscopic thermometer only one square micrometer across that can be integrated onto a chip to accurately track temperatures, using a new class of two-dimensional material known as bimetallic thiophosphates that had previously not been used in thermal sensors.
Applied Materials, Inc., Santa Clara, Calif., introduced a new defect review system to help semiconductor manufacturers continue pushing the limits of chip scaling combining the industry’s most sensitive electron beam technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale defects.
Backblaze, Inc., San Mateo, Calif., published its 2025 Year-End Drive Stats report that analyzes the performance of 344,196 hard drives across 30 models and found the annual failure rate drops to 1.36% across 344,000+ drives and high-capacity models are on the rise as first 26TB drives enter service.
Optotherm, Inc., Warrandale, Pa., a designer and manufacturer of infrared imaging components and systems, released the MW640-15, a high-sensitivity MWIR thermal imaging camera designed for front and backside IC failure analysis, lock-in thermography, and microscopic temperature measurement.
New research from the Department of Energy’s Oak Ridge National Laboratory found that applying an electric field to a ceramic material removes barriers to phonon transport, conducting heat almost three times more efficiently along the field direction, challenging conventional understanding about controlling heat flow in solid materials.
