The February 2026 issue of Electronic Device Failure Analysis includes: A Step Toward Automation in Failure Analysis; Advanced FA using In-Situ AFM in FIB-SEM; Enhancing Soft Defect Localization; and Highlights from ISTFA 2025.
Rice University researchers create a novel “metamaterial” that can potentially revolutionize implantable and ingestible devices. The team, led by Yong Lin Kong, assistant professor in the Department of Mechanical Engineering in the George R. Brown School of Engineering and Computing, have developed a soft but strong metamaterial that can be controlled remotely to rapidly transform […]
Surging global electricity demand driven by data centers, artificial intelligence and expanding manufacturing is straining power systems worldwide, highlighting the need for more efficient energy use rather than simply more generation. Researchers at the National Renewable Energy Laboratory have developed a new silicon carbide–based power module that significantly improves how electricity is converted and delivered. […]
Boise State University’s growing prominence in materials science and microelectronics is driven in part by the work of faculty members such as David Estrada, a U.S. Navy veteran and Boise State alumnus. Estrada earned his bachelor’s degree in electrical engineering from Boise State in 2007, supported by the McNair Scholars Program and multiple graduate research […]
The merger of Stanford Nano Shared Facilities and the Stanford Nanofabrication Facility in September created nano@stanford, now the university’s largest shared research facility on campus. Yuri Suzuki, the Stanley G. Wojcicki Professor in the School of Humanities and Sciences and a professor of applied physics, also serving by courtesy in materials science and engineering, was […]
