A team of researchers at the University of Barcelona has reportedly demonstrated a new bonding technique for surface mounted devices in which an inkjet printer with ink that incorporates silver nanoparticles bonds the devices.
Nikon Metrology, Brighton, Mich., introduces the XT V 160, a highly flexible and cost-effective electronics and semiconductor inspection system designed for production facilities and failure analysis laboratories.
Wisconsin Oven Corp., East Troy, Wis., has shipped three electrically heated, heavy-duty walk-in ovens with temperature uniformity of ±5°F for composite curing.
Seco Warwick, Meadville, Pa., announces that its engineering team has designed an innovative technology for continuous control over the heating and cooling of the entire cycle in multi-chamber furnaces.
Lucifer Furnaces, Warrington, Pa., has shipped a customized benchtop heat-treating furnace to R. Hueter Co., Beverly, Mass., a CNC machine shop, to harden beryllium-copper pins.
