The National Institute for Materials Science, Japan, reports that engineers have developed room-temperature-printed electronics, by which electronic devices can be manufactured at room temperature under ambient atmospheric conditions.

Cadence Design Systems Inc., San Jose, Calif., and Intel Corp., Santa Clara, Calif., announce that they are collaborating to support Intel’s 14nm Tri-Gate process technology for customers of Intel Custom Foundry.

Oxford Instruments Asylum Research, Santa Barbara, Calif., announces the new MFP-3D Infinity Atomic Force Microscope, which enables images such as the silicon nitride shown.

SUSS MicroTec, Germany, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house.

Semiconductor Research Corp., Research Triangle Park, N.C., reports that a team of researchers from Purdue University, Lafayette, Ind.; SEMATECH, Albany, N.Y.; and SUNY College of Nanoscale Science and Engineering, Albany, N.Y., are working on high-performance molybdenum disulfide field-effect transistors.