Researchers from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, developed a high-pressure liquid seal technique that eliminates bubble formation in PDMS-based PCR chips by proving that water vapor diffusion—not air expansion—is the main cause of bubbles.
Celera, Alameda, Calif., the leader in fully automated, AI-enhanced analog design, is now sampling the first ever analog IC completely designed by an autonomous software platform. Using Celera’s ChipHUB platform, the company improved engineering productivity by 10x, allowing the design of a high-performance buck (DC-to-DC) converter from specification to manufacturing release in a matter of […]
Siemens, Germany, opened its $190 million electrical equipment manufacturing facility in Fort Worth, Texas. A part of the company’s Smart Infrastructure business, the site is responsible for creating reliable and efficient electrical equipment such as low-voltage switchboards necessary to meet the demand from the booming data center market and America’s AI growth. The 500,000-square-foot facility […]
Master Bond Inc., Hackensack, N.J., released its newest product, Master Bond EP29LPSPND-3, a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications.
University of Michigan engineers developed a modified manufacturing process for electric vehicle batteries—using a stabilizing electrode coating and microscale channels—that could enable high ranges and fast charging in cold weather, solving problems that are turning potential EV buyers away.
