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Leica user interface for DVM6 microscope cuts time for 2D/3D scanned image acquisition

April 19, 2019

Leica Microsystems, Buffalo Grove, Ill., introduces LAS X.next, the new streamlined software user interface for the DVM6 digital microscope.

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Brewer Science receives 2018 Preferred Quality Supplier Award from Intel

April 19, 2019

Brewer Science, Rolla, Mo., has been selected by Intel as a recipient of a 2018 Preferred Quality Supplier (PQS) award, which is recognition by Intel of companies that Intel believes “have relentlessly pursued excellence and conducted business with resolute professionalism.”

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Edax Velocity Super EBSD camera offers indexing performance up to 4500 points/sec

April 19, 2019

Edax Inc., Mahwah N.J., has added a new, faster, low-noise CMOS camera to its Velocity EBSD camera series, which now includes two cameras tailored to specific EBSD analysis applications.

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Zeiss 3D x-ray imaging solutions designed for semiconductor packaging failure analysis

April 19, 2019

Zeiss, Germany, announces a new suite of high-resolution 3D x-ray imaging solutions for failure analysis of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages.

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Siemens Mentor Graphics software selected by Boeing to enable next-gen design

April 19, 2019

Siemens, Plano, Texas, announces that Boeing has entered into an agreement to expand its use of Siemens’ Mentor Graphics software as part of its Second Century Enterprise Systems (2CES) initiative to transform itself, and the aerospace industry, to meet the challenges of the twenty-first century.

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Applied Materials receives Intel’s Preferred Quality Supplier Award for excellence

April 19, 2019

Applied Materials Inc., Santa Clara, Calif., has been selected as a recipient of an Intel 2018 Preferred Quality Supplier (PQS) award, which recognizes companies that Intel believes have “relentlessly pursued excellence and conducted business with resolute professionalism."

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2018 global semiconductor equipment sales jump to record $64.5 billion

April 19, 2019

SEMI, Milpitas, Calif., the industry association representing the worldwide electronics product design and manufacturing supply chain, reports that worldwide sales of semiconductor manufacturing equipment surged 14 percent from $56.62 billion in 2017 to an all-time high of $64.5 billion in 2018

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ASM International Renews Accreditation as Provider of IACET CEUs

April 18, 2019

ASM International is honored to announce the reaccreditation of their education courses for Continuing Education Units (CEUs). The award was given to ASM by the International Association for Continuing Education and Training (IACET). IACET is the only standard-setting organization approved by the American National Standards Institute (ANSI) for continuing education and training.

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AFC Holcroft provides UBQ and UBT heat treating furnaces to Specialty Steel Treating

April 16, 2019

AFC Holcroft, Wixom, Mich., announces that it has supplied a UBQ (universal batch quench) furnace and a UBT (universal batch temper) annealing furnace to Specialty Steel Treating as part of a larger multi-year equipment standardization program intended to replace older equipment provided by another supplier.

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Baker Furnace develops point-and-click augmented reality platform for its furnaces

April 16, 2019

Baker Furnace, Yorba Linda, Calif., a division of Thermal Product Solutions, has developed an augmented reality (AR) platform for its furnace lines, allowing operators, maintenance personnel, and engineers to interact with the furnace through a tablet.

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Universal Stainless invests $10 million for upgrades to specialty steel facility in New York

April 16, 2019

Universal Stainless and Alloy Products Inc., Bridgeville, Pa., announces that it has added a new bar turn and burnish line and a new General Electric phased-array nondestructive testing system to its facility in Dunkirk, New York.

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