ASM Industry News
ASM Industry News
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February 20, 2019Buehler, Lake Bluff, Ill., introduces the Wilson UH4000 series universal hardness testers, which are designed for high-volume production labs and the production floor.
February 20, 2019Hydrogen, the second-tiniest of all atoms, can penetrate right into the crystal structure of a solid metal. That’s good news for efforts to store hydrogen fuel safely within the metal itself, but it is bad news for structures such as the pressure vessels in nuclear plants, where hydrogen uptake eventually makes the vessel’s metal walls more brittle, which can lead to failure. But this...
February 19, 2019Buehler, Lake Bluff, Ill., an ITW company, introduces the AutoMet family of semi-automatic grinder-polishers that feature a new intuitive touch screen interface that is simple to learn and quick to operate.
February 19, 2019Soitec, France, announces an expanded collaboration with Samsung Foundry to ensure the volume supply of fully depleted silicon-on-insulator (FD-SOI) wafers.
February 19, 2019Rigaku Europe SE and Fraunhofer IISB, both in Germany, announce the formation of a strategic partnership to revolutionize the characterization of semiconductor materials by x-ray topography.
February 18, 2019Ultra Tec Manufacturing Inc., Santa Ana, Calif., announces the availability of a greatly expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station.
February 17, 2019The University of Oregon, Eugene, announces that its researchers have created STEM holography, a new technique that provides improved atomic resolution of a sample's outer structure and unveils previously unseen interfaces between the sample surface and the underlying material.
February 17, 2019ST Microelectronics, Geneva, has signed an agreement to acquire a majority stake in Swedish silicon carbide wafer manufacturer Norstel AB. After closing, ST will control the entire supply chain for a portion of its SiC devices at a time of constrained global capacity, positioning itseIf for a significant growth opportunity.
February 17, 2019Purdue University, West Lafayette, Ind., announces the formation of the Center for Heterogeneous Integration Research in Packaging, or CHIRP, a new multimillion dollar semiconductor research center that will be co-directed by Ganesh Subbarayan, professor of mechanical engineering at Purdue, and Bahgat Sammakia, vice president for research and a distinguished professor of mechanical...
February 17, 2019Bruker, Belgium, introduces the Skyscan 1273 benchtop 3D x-ray microscope based on micro-computed tomography technology, enabling samples with up to 500 mm length, 300 mm diameter, and a maximum weight of 20 kg to be investigated with powerful and precise positioning stages.