ASM Industry News
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April 22, 2019HRL Laboratories LLC, Malibu, Calif., is commercializing its additively manufactured (3D-printed) high-strength aluminum, which has obtained the first ever registration of an additive alloy from the Aluminum Association.
April 22, 2019Hitachi High-Technologies Corp., Tokyo, announces that it will commence sales of the SU3800 and the oversized SU3900 scanning electron microscopes featuring the ability to accommodate large, heavy specimens, along with advanced functionalities for automated measurement and wide-angle camera navigation.
April 20, 2019Scientists at Tohoku University in Japan report that they fabricated an electrode by printing copper nanoparticle-based nanopastes onto a glass substrate using a metal screen mask and pressureless sintering under a nitrogen atmosphere at 200 °C for 30 minutes.
April 19, 2019The normalizing temperature for ductile iron is usually between 870 and 940°C (1600 and 1725°F).
April 19, 2019Witec, Germany, announces that its WITec alpha300 Ri inverted confocal Raman microscope has been honored by the worldwide readership of SelectScience.net with the Scientists’ Choice Award for Best New Product in the category of Spectroscopy.
April 19, 2019Leica Microsystems, Buffalo Grove, Ill., introduces LAS X.next, the new streamlined software user interface for the DVM6 digital microscope.
April 19, 2019Brewer Science, Rolla, Mo., has been selected by Intel as a recipient of a 2018 Preferred Quality Supplier (PQS) award, which is recognition by Intel of companies that Intel believes “have relentlessly pursued excellence and conducted business with resolute professionalism.”
April 19, 2019Edax Inc., Mahwah N.J., has added a new, faster, low-noise CMOS camera to its Velocity EBSD camera series, which now includes two cameras tailored to specific EBSD analysis applications.
April 19, 2019Zeiss, Germany, announces a new suite of high-resolution 3D x-ray imaging solutions for failure analysis of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages.
April 19, 2019Siemens, Plano, Texas, announces that Boeing has entered into an agreement to expand its use of Siemens’ Mentor Graphics software as part of its Second Century Enterprise Systems (2CES) initiative to transform itself, and the aerospace industry, to meet the challenges of the twenty-first century.