ISTFA 2018 Plan today to attend ISTFA 2018! This year’s theme is Failures Worth Analyzing. We will soon be accepting papers for the technical program of the 44th International Symposium for Testing and Failure Analysis (ISTFA). Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Submit your minimum two-page abstract including images, figures, and references.
Call for Papers
The call for Papers is now open!
Submit your abstract by April 21, 2018 to be considered for the ISTFA 2018 technical program.
Share your experiences and advance the industry and your career at the 44th International Symposium for Testing and Failure Analysis (ISTFA), the premier event for the microelectronics failure analysis community. We invite you to submit your work for publication and to present to the industry in Phoenix, Arizona for the 44th year of ISTFA.
EDFAS is Seeking Student Board Members
The ASM Electronic Device Failure Analysis Society (EDFAS) is seeking applicants for its student board member position. Students must be a registered undergraduate or graduate during the 2018-2019 academic year and must be studying or involved in research in an area closely related to failure analysis. Application deadline is to April 23, 2018.