44th International Symposium for Testing and Failure Analysis Conference & Exposition
October 28 - November 1, 2018
Plan today to attend ISTFA 2018! This year's theme is ‘Failures Worth Analyzing.'
Organizers are now accepting papers for the technical program of the 44th International Symposium for Testing and Failure Analysis (ISTFA). Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Submit your minimum two-page abstract including images, figures, and references.
Submit your abstract by April 27, 2018 to be considered for the ISTFA 2018 technical program.
Video Contest Winners
1st Place: Wentao Qin, ON Semiconductor
2nd Place: Ian Kearney, Mark Dipsey and Bruce Gillette, Texas Instruments
Picosecond Time Resolved LADA Integrated with a Solid Immersion Lens on a Laser Scanning Microscope
Presenting Author: Kristofor Dickson
Steps Toward Automated Deprocessing of Integrated Circuits
Presenting Author: Ed Principe
Uncover the Underneath Hidden Defects Through Fast Selective Chemical Etching in Wafer Fabrication
Presenting Author: Ng Hui Peng—GLOBALFOUNDRIES Singapore Pte Ltd
Best Student Poster
Acceptable Laser Dose of 28 nm FDSOI Technology-Correlation of Experiment and Simulation
Presenting Author: Maxime Penzes—EFA Design
Author: Stephen T. Fasolino —Raytheon
A Foil Odyssey
Author: Terry Stark—Qorvo