45th International Symposium for Testing and Failure Analysis Conference & Exposition
November 10-14, 2019
Plan today to attend ISTFA 2019!
The advent of Artificial Intelligence and the promise of quantum computing are driving disruptive computing architectures. Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Submit your abstract by April 19, 2019 to be considered for the ISTFA 2019 technical program.
Video Contest Winners
1st Place: Wentao Qin, ON Semiconductor
Picosecond Time Resolved LADA Integrated with a Solid Immersion Lens on a Laser Scanning Microscope
Presenting Author: Kristofor Dickson
Steps Toward Automated Deprocessing of Integrated Circuits
Presenting Author: Ed Principe
Uncover the Underneath Hidden Defects Through Fast Selective Chemical Etching in Wafer Fabrication
Presenting Author: Ng Hui Peng—GLOBALFOUNDRIES Singapore Pte Ltd
Best Student Poster
Acceptable Laser Dose of 28 nm FDSOI Technology-Correlation of Experiment and Simulation
Presenting Author: Maxime Penzes—EFA Design
Author: Stephen T. Fasolino —Raytheon
A Foil Odyssey
Author: Terry Stark—Qorvo