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Zeiss Zen Connect software for microscopes enables imaging all dimensions of a sample

May 24, 2018

Carl Zeiss, Germany, introduces Zen Connect, new software modules with enhanced imaging technology that is especially useful for structural analysis.

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Thermo Scientific Apreo SEM for materials science features compound lens design

May 24, 2018

Thermo Scientific, Hillsboro, Oregon, has developed the Apreo scanning electron microscope, which features a revolutionary compound lens design that combines electrostatic and magnetic immersion technology to yield unprecedented resolution and signal selection.

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Oxford Instruments’ Layerprobe software tool designed for thin film analysis

May 22, 2018

Oxford Instruments, U.K., offers LayerProbe, a software tool for thin film analysis in the SEM that is said to be faster and more cost-effective, with higher resolution than dedicated thin film measurement tools.

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Cohu to acquire Xcerra for its back-end semiconductor test and inspection equipment

May 21, 2018

Cohu Inc., Poway, Calif., and Xcerra Corp., Norwood, Mass., have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.

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Global semiconductor sales up 20% year-over-year in first quarter of 2018

May 21, 2018

The Semiconductor Industry Association, Washington, announces that worldwide sales of semiconductors reached $111.1 billion during the first quarter of 2018, an increase of 20 percent compared to the first quarter of 2017, but 2.5 percent less than the fourth quarter of 2017.

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Adesto Tech acquires S3 Semiconductors to expand its portfolio of technologies

May 21, 2018

Adesto Technologies, Santa Clara, Calif., a provider of innovative application-specific semiconductors for the IoT era, announces that it has acquired Dublin-based S3 Semiconductors, a global supplier of mixed-signal and RF application specific integrated circuits (ASIC) and an extensive library of design IP.

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EV Group to expand manufacturing facility for wafer bonding, lithography equipment

May 21, 2018

EV Group, Austria, has started construction work for its Manufacturing III facility, the next expansion phase of its corporate headquarters.

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Semtech acquires IC Interconnect to strengthen R&D for next-gen protection platforms

May 21, 2018

Semtech Corp., Camarillo, Calif., has acquired substantially all the assets of IC Interconnect Inc., Colorado Springs, Colo., which provides contract wafer bumping and related services to the electronics industry.

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JEOL, Digital Surf partner to launch SEM software for visualizing, analyzing, reporting

May 20, 2018

JEOL, Tokyo, and Digital Surf, France, announce the release of Digital Surf’s Smile View Map software for users of JEOL’s scanning electron microscope systems.

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Leica Center of Excellence in microscopy launched at California NanoSystems Institute

May 20, 2018

The University of California at Los Angeles, in collaboration with Leica Microsystems Inc., Germany, has established the Leica Center of Excellence at UCLA to fast-track the commercial development of new optical microscopy tools and methods.

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