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Delayering Techniques: Dry Processes Wet Chemical Processing and Parallel Lapping

Author: Kendall Scott Wills, Srikanth Perungulam, Texas Instruments   |   Document Download   |   Product code: ZMEFA2011P397

File size: 4 MB

Classified as: Electronic Materials

Price: $25.00 Member Price: $20.00
The purpose of this paper is to present the techniques required to delayer a semiconductor device built with current state of the art silicon processing technologies. Many of the techniques with appropriate modifications will be transferable to other technologies. The user will be left to decide when and how to use them.
  • From: Microelectronics Failure Analysis, Desk Reference Sixth Edition
  • Published: October 01, 2011
  • Pages: 20
  • Review Type: Peer reviewed