Web Content Display

Email a friend

The Art of Cross Sectioning

Author: B. Engel, E. Levine, J. Petrus, A. Shore, IBM Microelectronics   |   Document Download   |   Product code: ZMEFA2011P417

File size: 18 MB

Classified as: Electronic Materials Electronics

Price: $25.00 Member Price: $20.00
ASM Points required to purchase: 20
Add To Cart

Login to view your points.   Learn more

A modern semiconductor facility that is involved with day-to-day production as well as development is highly dependent on a facility that can rapidly produce high quality SEM images of products being manufactured. The ability to cross-section targets such as individual contacts as small as 0.15 microns (or less), while often taking several sequential sections through such targets, is important when looking for small defects and process detail. Such data provides input to engineers and technicians on the quality and general characteristics of the structures being built as well as the origin of defects that detract from yield.
  • From: Microelectronics Failure Analysis, Desk Reference Sixth Edition
  • Published: October 01, 2011
  • Pages: 9
  • Review Type: Peer reviewed