Technical Resources

Technical Resources

Web Content Listing

ISTFA 2014, Proceedings from the 40th International Symposium for Testing and Failure Analysis

Published: 2014

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.

Material Resources / Publications

Lead-Free Solder Interconnect Reliability

Published: 2005

Price: $69.00 Member Price: $49.00

Provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed.

Material Resources / Publications

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Microelectronics Failure Analysis Desk Reference, 6th Ed (Book & CD set)

Published: 2011

Comprehensive guide to the process and test methods used for electronic device failure analysis.

Material Resources / Publications

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ASM Affiliate Societies