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May 20, 2019Rigaku, Japan, introduces its new Smart Sample Loading System (SSLS), in which a vacuum chuck can be used to load samples into pre-loaded sample holders, saving time and increasing the number of samples that can be held on the sample deck
May 20, 2019Hitachi High-Technologies Corp., Tokyo, announces that it will commence sales of the SU3800 and the oversized SU3900 scanning electron microscopes, which feature the ability to accommodate large, heavy specimens, along with advanced functionalities for automated measurement and wide-angle camera navigation.
May 17, 2019Nanotronics, Brooklyn, N.Y., has expanded its Super Resolution imaging system portfolio with a new patented system that identifies and classifies defects at lower resolutions than traditional inspection microscopy, providing faster scan times and enhanced throughput.
May 17, 2019The Semiconductor Industry Association, Washington, has released a set of government policy recommendations for sustaining and strengthening America’s global leadership in semiconductor technology and ensuring that the United States wins the race to harness the transformative semiconductor-enabled technologies of the future.
May 17, 2019This ITSC 2019 presentation discusses the plasma treatment of large-scale substrates, because the size of semiconductor and flat-panel-display (FPD) production equipment for dry etching and sputtering has been increasing due to the increased size of both silicon wafers and displays.
May 17, 2019Veeco Instruments Inc., Plainview, N.Y., announces that SkyWater Technology Foundry has taken delivery of the WaferStorm single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology.
May 14, 2019The Semiconductor Industry Association, Washington, has released a set of government policy recommendations for sustaining and strengthening America’s global leadership in semiconductor technology and ensuring that the United States wins the race to harness the transformative semiconductor-enabled technologies of the future.
May 13, 2019Leco, Saint Joseph, Mich., introduces the MX400 mounting press, which offers dual mount capability, a slim eight-inch design, a simple steel closure, low thermal mass, and energy-efficient heating with substantially faster cooling than previous generations of mounting presses.
May 13, 2019Saki Corp., Japan, announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection system, which automates the bottom-side inspection process, eliminates board flipping and handling, and ensures quality after the potting, dip, wave, and selective soldering processes.
May 13, 2019Optotherm, Sewickley, Pa., offers the Sentris thermal imaging microscope, which pinpoints the low-level infrared thermal emissions by IC faults such as short circuits and leakage current.