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Saki introduces ultra-fast 2D bottom-side automated optical inspection for PCBs
May 13, 2019
Source: ASM International
Saki Corp., Japan, announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection system, which automates the bottom-side inspection process, eliminates board flipping and handling, and ensures quality after the potting, dip, wave, and selective soldering processes.
Saki's 2D line-scan technology is ultra-fast, capturing the image of an entire 460x500mm printed circuit board assembly and carriers of 610x610mm in one pass, in real time. It then stores the image into memory, and creates inspection data for the entire board.
The 2Di-LU1 software includes Saki's proprietary Fujiyama algorithm, which provides complete through-hole joint inspection in a single step. It simultaneously inspects for copper exposure, pin detection, pin-holes, solder ﬁllet abnormalities, missing components, soldering problems, and bridges. Saki's inspection software has been used for extra component detection of solder balls and foreign objects and through-hole device inspection in the automotive industry for several years and complies with the IPC-A-610 standard.
"Incorporating bottom-side AOI into the assembly process increases productivity by reducing the time, costs, labor, and floorspace needed for manual inspection, additional conveyors, or equipment to flip the board," explained Yoshihiro Akiyama, chief technical officer, Saki Corporation. "Saki's system speeds the inspection process, increases throughput, and eliminates extra PCBA handling and the risk of substrate damage."
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Materials Testing and Evaluation | Failure Analysis
Materials Testing and Evaluation | Microelectronic Failure Analysis