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Axial Suspension Plasma Sprayed Ceramic Coatings for Semiconductor Applications
May 17, 2019
Source: ASM International
This ITSC 2019 presentation discusses the plasma treatment of large-scale substrates. The size of semiconductor and flat-panel-display (FPD) production equipment for dry etching and sputtering has been increasing due to the increased size of both silicon wafers and displays.
Plasma treatment is used for micro~nano fabrication, especially in dry etching, and a higher plasma power is needed to fabricate the large-scale substrates with high etching rates. This trend presents higher requirements on the plasma erosion-resistant coatings on the inside wall of the chamber. High-purity oxide ceramics such as alumina (Al2O3) and yttria (Y2O3) are good coating materials against plasma erosion.
These coatings have been used primarily applied with plasma spraying agglomerated-and-sintered powders. In this study, Al2O3 and Y2O3 coatings were sprayed using axial suspension plasma spraying with fine powders. The resulting coatings were harder, denser and smoother with improved plasma erosion resistance and dielectric properties compared to traditional plasma coatings. The effect of the powder properties on the coating structure were investigated, and their erosion resistance and dielectric properties are discussed.
Dr. Zhaolin Tang, Gaspar Masindo, Mr. Neil Young, Northwest Mettech Corp., Surrey, BC, Canada
Wednesday, May 29, 2019: 11:40
Annex Hall/F201 (Pacifico Yokohama)
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