Web Content Display

U.S. semiconductor industry calls for federal policies to advance chip technology

May 17, 2019
Source: ASM International

The Semiconductor Industry Association, Washington, has released a set of government policy recommendations for sustaining and strengthening America’s global leadership in semiconductor technology and ensuring that the United States wins the race to harness the transformative semiconductor-enabled technologies of the future. These include artificial intelligence, quantum computing, and advanced wireless networks.


The report, titled “Winning the Future: A Blueprint for Sustained U.S. Leadership in Semiconductor Technology,” urges U.S. government leaders to significantly increase investments in semiconductor research, help attract and develop the world’s most skilled technology workforce, and ensure open markets and strong protection of intellectual property. SIA represents U.S. leadership in semiconductor manufacturing, design, and research.


The Winning the Future blueprint highlights two core challenges to continued semiconductor innovation and U.S. leadership in this sector. First, semiconductor technology advancements are pushing against barriers of physics, and breakthroughs to move beyond these limits and keep America in front require greater investment in research.


Second, while the U.S. semiconductor industry leads the world with nearly half of global market share, overseas governments such as China’s are seeking to challenge U.S. leadership by making significant investments to achieve breakthroughs in semiconductor technology, artificial intelligence, and quantum computing.


The report identifies three domestic policy areas – research, workforce, and trade/IP protection – where urgent government action is needed to ensure that America rises to these challenges and sustains its global leadership in semiconductor technology and the revolutionary technologies semiconductors enable. 


Subject Classifications

Materials Properties and Performance | Electrical Properties

Materials Properties and Performance | Physical Properties

Materials Properties and Performance | Thermal Properties

Materials Testing and Evaluation | Failure Analysis

Materials Testing and Evaluation | Microelectronic Failure Analysis

Email a friend