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November 09, 2018Buehler, Lake Bluff, Ill., and Instron, Norwood, Mass., demonstrated their latest innovations, accessories, and consumables for materials testing in the electronics industry at ISTFA 2018.
November 09, 2018Oxford Instruments, England, announces that Tata Steel, India, recently upgraded its EBSD facility at its Advanced Material Characterization Laboratory by replacing the existing Oxford Instruments Nordlys detector and Aztec HKL EBSD, with the latest CMOS sensor-based Symmetry EBSD detector system.
November 09, 2018Tescan USA, Warrendale, Pa., introduces the S9000X, its latest flagship Xe plasma FIB-SEM, which provides precise, damage-free large area cross-sectioning coupled with a high throughput rate, up to 50 times faster than conventional gallium FIBs.
November 09, 2018H.C. Starck Analytical Services, Germany, announces that it will become an independent company with the name ChemiLytics GmbH & Co. KG, yet will remain part of the H.C. Starck Group and will serve both internal and external customers.
October 22, 2018Presto Engineering, San Jose, Calif., reports that it has completed certification to the ISO 9001:2015 quality standard at its facility in Caen, France, which is Europe’s largest independent semiconductor test facility.
October 21, 2018SEMI, Washington, reports that worldwide sales of new semiconductor manufacturing equipment are projected to increase 9.7 percent to $62.1 billion in 2018, exceeding the historic high of $56.6 billion set last year.
October 21, 2018Thermo Scientific, Waltham, Mass., has developed the Verios G4 scanning electron microscope, which has extended sub-nanometer resolution over the full 1 keV to 30 keV energy range to novel materials such as catalyst particles, nanotubes, porosities, interfaces, and other nanoscale structures.
October 21, 2018Ultra Clean Holdings Inc., Hayward, Calif., has signed an agreement to acquire Quantum Global Technologies (QGT), Philadelphia, for $342 million.
October 21, 20183D-Micromac AG, Chemnitz, Germany, introduces the Microprep 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis.