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Keep up-to-date on the latest advances in the metals and materials industry with ASM Industry News.

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Rigaku and Fraunhofer partner to expand x-ray topography for semiconductor wafers

February 19, 2019

Rigaku Europe SE and Fraunhofer IISB, both in Germany, announce the formation of a strategic partnership to revolutionize the characterization of semiconductor materials by x-ray topography.

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Ultra Tec introduces expanded software toolkit and interactive graphics for IC processing

February 18, 2019

Ultra Tec Manufacturing Inc., Santa Ana, Calif., announces the availability of a greatly expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station.

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STEM microscope generates two electron beams to make holographs of atomic structure

February 17, 2019

The University of Oregon, Eugene, announces that its researchers have created STEM holography, a new technique that provides improved atomic resolution of a sample's outer structure and unveils previously unseen interfaces between the sample surface and the underlying material.

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ST Microelectronics to acquire majority stake in wafer manufacturer Norstel AB

February 17, 2019

ST Microelectronics, Geneva, has signed an agreement to acquire a majority stake in Swedish silicon carbide wafer manufacturer Norstel AB. After closing, ST will control the entire supply chain for a portion of its SiC devices at a time of constrained global capacity, positioning itseIf for a significant growth opportunity.

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SRC sponsors semiconductor packaging research center at Purdue and Binghamton

February 17, 2019

Purdue University, West Lafayette, Ind., announces the formation of the Center for Heterogeneous Integration Research in Packaging, or CHIRP, a new multimillion dollar semiconductor research center that will be co-directed by Ganesh Subbarayan, professor of mechanical engineering at Purdue, and Bahgat Sammakia, vice president for research and a distinguished professor of mechanical...

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Bruker introduces Skyscan benchtop 3D x-ray microscope with three-micron voxel size

February 17, 2019

Bruker, Belgium, introduces the Skyscan 1273 benchtop 3D x-ray microscope based on micro-computed tomography technology, enabling samples with up to 500 mm length, 300 mm diameter, and a maximum weight of 20 kg to be investigated with powerful and precise positioning stages.

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Zeiss launches 3D x-ray imaging solutions for failure analysis of semiconductors

February 17, 2019

Zeiss, Germany, announces that a new suite of 3D x-ray imaging solutions that provide submicron and nanoscale 3D images of features and defects buried within intact structures in advanced package 3D architectures has been developed by its scientists: Xradia Context microCT, Xradia 600-series Versa 3D XRM, and Xradia 800-series Versa 3D XRM.

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Global semiconductor sales increase by 13.7% in 2017 to $468.8 billion in 2018

February 17, 2019

The Semiconductor Industry Association (SIA), Washington, representing U.S. leadership in semiconductor manufacturing, design, and research, announces that the global semiconductor industry posted sales of $468.8 billion in 2018, the industry’s highest-ever annual total and an increase of 13.7 percent compared to the 2017 total.

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Atomic force microscope from Asylum Research scans surface ten times faster at high resolution

January 21, 2019

Oxford Instruments Asylum Research, U.K., introduces the Cypher VRS AFM, a full-featured video-rate atomic force microscope that enables researchers to measure nanoscale dynamic processes at video-rate speeds with all of the resolution, versatility, and ease of use of an Asylum Research Cypher AFM.

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Keyence VHX 6000 microscope combines brightfield and darkfield for optimal lighting

January 21, 2019

Keyence, Japan, offers the VHX-6000 digital microscope with the capability to view, capture, and measure at magnifications ranging from 20X to 2000X.

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