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HRL Labs commercializes 3D-printable high-strength aluminum alloy

April 22, 2019

HRL Laboratories LLC, Malibu, Calif., is commercializing its additively manufactured (3D-printed) high-strength aluminum, which has obtained the first ever registration of an additive alloy from the Aluminum Association.

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Hitachi High-Technologies launches scanning electron microscopes for large specimens

April 22, 2019

Hitachi High-Technologies Corp., Tokyo, announces that it will commence sales of the SU3800 and the oversized SU3900 scanning electron microscopes featuring the ability to accommodate large, heavy specimens, along with advanced functionalities for automated measurement and wide-angle camera navigation.

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Copper nanoparticle pastes bond copper plates into possible future electrodes

April 20, 2019

Scientists at Tohoku University in Japan report that they fabricated an electrode by printing copper nanoparticle-based nanopastes onto a glass substrate using a metal screen mask and pressureless sintering under a nitrogen atmosphere at 200 °C for 30 minutes.

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One Minute Mentor: Hardness of normalized ductile iron tempered at various temperatures

April 19, 2019

The normalizing temperature for ductile iron is usually between 870 and 940°C (1600 and 1725°F).

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WITec wins Scientists’ Choice Award for its inverted confocal Raman microscope

April 19, 2019

Witec, Germany, announces that its WITec alpha300 Ri inverted confocal Raman microscope has been honored by the worldwide readership of SelectScience.net with the Scientists’ Choice Award for Best New Product in the category of Spectroscopy.

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Leica user interface for DVM6 microscope cuts time for 2D/3D scanned image acquisition

April 19, 2019

Leica Microsystems, Buffalo Grove, Ill., introduces LAS X.next, the new streamlined software user interface for the DVM6 digital microscope.

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Brewer Science receives 2018 Preferred Quality Supplier Award from Intel

April 19, 2019

Brewer Science, Rolla, Mo., has been selected by Intel as a recipient of a 2018 Preferred Quality Supplier (PQS) award, which is recognition by Intel of companies that Intel believes “have relentlessly pursued excellence and conducted business with resolute professionalism.”

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Edax Velocity Super EBSD camera offers indexing performance up to 4500 points/sec

April 19, 2019

Edax Inc., Mahwah N.J., has added a new, faster, low-noise CMOS camera to its Velocity EBSD camera series, which now includes two cameras tailored to specific EBSD analysis applications.

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Zeiss 3D x-ray imaging solutions designed for semiconductor packaging failure analysis

April 19, 2019

Zeiss, Germany, announces a new suite of high-resolution 3D x-ray imaging solutions for failure analysis of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages.

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Siemens Mentor Graphics software selected by Boeing to enable next-gen design

April 19, 2019

Siemens, Plano, Texas, announces that Boeing has entered into an agreement to expand its use of Siemens’ Mentor Graphics software as part of its Second Century Enterprise Systems (2CES) initiative to transform itself, and the aerospace industry, to meet the challenges of the twenty-first century.

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