Plan today to attend ISTFA 2018! This year’s theme is Failures Worth Analyzing.
While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable. Some have moved their factories to low cost centers and many outsource IC fabrication to external foundries which makes Failure Analysis more challenging. Is it time to rethink failure analysis strategy to reduce cost? Should we identify the most efficient workflow and equipment for hard failures vs. soft failures or systematic failures vs. random failures? How about designing a workflow that focuses on high return, high value failure analysis to maximize return on FA investments?
We will soon be accepting papers for the technical program of the 44th International Symposium for Testing and Failure Analysis (ISTFA). Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Submit your minimum two-page abstract including images, figures, and references.
Deadline for Abstract Submission: April 21, 2018