Events EBO Smst

CALL FOR PAPERS

International Symposium for Testing and Failure Analysis

  • Oct 28 – Nov 1 , 2018
  • Phoenix, Arizona

ISTFA 2018

ISTFA 2018

Plan today to attend ISTFA 2018!  This year’s theme is Failures Worth Analyzing.

While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable. Some have moved their factories to low cost centers and many outsource IC fabrication to external foundries which makes Failure Analysis more challenging. Is it time to rethink failure analysis strategy to reduce cost? Should we identify the most efficient workflow and equipment for hard failures vs. soft failures or systematic failures vs. random failures? How about designing a workflow that focuses on high return, high value failure analysis to maximize return on FA investments?

We will soon be accepting papers for the technical program of the 44th International Symposium for Testing and Failure Analysis (ISTFA).  Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Submit your minimum two-page abstract including images, figures, and references.

 

Deadline for Abstract Submission:  April 21, 2018

 

ISTFA 2017 Highlights

 

Best Paper

Backside Protection Structure for Security Sensitive ICs

Presenting Author: Ms. Elham Amini—Technical University of Berlin

 

Outstanding Paper

Characterization of Gate Oxide Pinhole Defect in NMOS FinFET Devices

Presenting Author: Mr. Liangshan Chen—GLOBALFOUNDRIES

 

Best Student Paper

Making Synchrotron Tomography a Routine Tool for 3D Integration Failure Analysis Through a Number of Projections, an Adapted Sample Preparation Scheme, and a Fully-Automated Post-Processing

Presenting Author: Ms. Alexandra Fraczkiewicz—University Grenoble Alpes; CEA, LETI, MINATEC Campus

 

Best Poster

Uncover the Underneath Hidden Defects Through Fast Selective Chemical Etching in Wafer Fabrication

Presenting Author: Ng Hui Peng—GLOBALFOUNDRIES Singapore Pte Ltd

 

Best Student Poster

Acceptable Laser Dose of 28 nm FDSOI Technology-Correlation of Experiment and Simulation

Presenting Author: Maxime Penzes—EFA Design

 

Best Video

Electomigration Station

Author: Stephen T. Fasolino —Raytheon

 

Outstanding Video

A Foil Odyssey

Author: Terry Stark—Qorvo

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