Call for Papers
Call for Papers
Deadline EXTENDED to Friday, April 27
Submit your abstract by April 21, 2018 to be considered for the ISTFA 2018 technical program.
Share your experiences and advance the industry and your career at the 44th International Symposium for Testing and Failure Analysis (ISTFA), the premier event for the microelectronics failure analysis community. We invite you to submit your work for publication and to present to the industry in Phoenix, Arizona for the 44th year of ISTFA.
Original, unpublished, and novel material is being solicited on testing, analysis, characterization, and metrology of electronic devices and systems from the nanoscale and upward.
Case studies, review papers, and non-commercial work from vendors are encouraged.
Technical symposia, user groups, seminars, short courses, and the largest equipment exposition in the industry make ISTFA the best place to learn, network, and further your career!
Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Submit your minimum two-page abstract including images, figures, and references.
Original, unpublished abstracts are solicited in the follow topic areas:
- Emerging FA Techniques and Concepts
- Future Challenges of FA
- Fault Isolation (Thermal, Lock-in thermography, static and dynamic laser stimulation, static and dynamic emission microscopy, Laser Voltage Probing and imaging...)
- 3D devices Failure Analysis (stacked dies, TSV...)
- FA Techniques Addressing the Challenges of Heterogeneous Systems in Package
- Organic Electronic (OLED...)
- Wireless, Self-Powered, Sensors, MEMS Failure Analysis
- Detecting Counterfeit Microelectronics
- Alternative Energy (Photovoltaics, Solid State Lighting, etc...)
- FA Process
- Packaging and Assembly Level FA
- Diagnostic Testing, Scanning and Debug
- Board and System Level FA
- Metrology and In-line Device Characterization
- Power, Discretes and Optoelectronic Device FA
- Electronic Device Materials Characterization (SIMS, RBS, XPS, Auger, etc...)
- Microscopy (SEM, TEM, FIB, etc.)
- Circuit Edit (Laser, FIB, etc.)
- Sample Preparation and Device Deprocessing
- Scanning Probe Analysis
- Yield and Reliability Enhancement
- Nanoprobing, Electrical Characterization
- Competitive Analysis and Reverse Engineering
- FA use cases
Please note, authors are allowed to present a maximum of two papers (oral or poster).