Plan today to attend ISTFA 2018! This year’s theme is Failures Worth Analyzing.
While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable. Some have moved their factories to low cost centers and many outsource IC fabrication to external foundries which makes Failure Analysis more challenging. Is it time to rethink failure analysis strategy to reduce cost? Should we identify the most efficient workflow and equipment for hard failures vs. soft failures or systematic failures vs. random failures? How about designing a workflow that focuses on high return, high value failure analysis to maximize return on FA investments?
We will soon be accepting papers for the technical program of the 44th International Symposium for Testing and Failure Analysis (ISTFA). Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Submit your minimum two-page abstract including images, figures, and references.
Deadline for Abstract Submission: April 21, 2018
ISTFA will be co-located with ITC.
This year’s Co-location provides some great benefits to the attendees:
• Network with two thousand attendees
• Shared keynote and select parts of the technical program
• See over 150 solutions providers on the shared exhibit floor
• Registration option for access to both conferences
ISTFA 2017 Highlights
Picosecond Time Resolved LADA Integrated with a Solid Immersion Lens on a Laser Scanning Microscope
Presenting Author: Kristofor Dickson
Steps Toward Automated Deprocessing of Integrated Circuits
Presenting Author: Ed Principe
Attendees' Best Paper
Characterization of Gate Oxide Pinhole Defect in NMOS FinFET Devices
Presenting Author: Liangshan Chen
Best Student Paper
Making Synchrotron Tomography a Routine Tool for 3D Integration Failure Analysis Through a Number of Projections, an Adapted Sample Preparation Scheme, and a Fully-Automated Post-Processing
Presenting Author: Ms. Alexandra Fraczkiewicz - CEA-Leti
Outstanding Student Paper
Backside Protection Structure for Security Sensitive ICs
Presenting Author: Elham Amini
Uncover the Underneath Hidden Defects Through Fast Selective Chemical Etching in Wafer Fabrication
Presenting Author: Ng Hui Peng—GLOBALFOUNDRIES Singapore Pte Ltd
Best Student Poster
Acceptable Laser Dose of 28 nm FDSOI Technology-Correlation of Experiment and Simulation
Presenting Author: Maxime Penzes—EFA Design
Author: Stephen T. Fasolino —Raytheon
A Foil Odyssey
Author: Terry Stark—Qorvo