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The advent of Artificial Intelligence and the promise of quantum computing are driving disruptive computing architectures. Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Call For Papers

We will soon be accepting papers for the technical program of the 45th International Symposium for Testing and Failure Analysis (ISTFA)Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Submit your minimum two-page abstract including images, figures, and references.

Deadline for Abstract Submission:  April 19, 2019

Submit Abstract!

 

CONGRATULATIONS
ISTFA 2018 AWARD WINNERS!

EDFAS 2018 VIDEO CONTEST WINNER
“Seeing is Believing”
Sandeep Kullar, Nordson Dage

 

ISTFA 2018 BEST PAPER
“Scan Chain Fault Isolation using Single Event Upsets Induced by a Picosecond 1064 nm Laser”
(Emerging FA Techniques and Concepts session)

Keith Serrels, NXP Semiconductor


ISTFA 2018 OUTSTANDING PAPER
“Power Device Burned Completely – And Now, How to Find the Root Cause?”
(Board and System Level FA session)

Peter Jacob, EMPA


ISTFA 2018 ATTENDEES’ BEST PAPER
“Asymmetric Data – Frequency Mapping and Multi Trigger – Probing for Improved Scan Debug”
(Product Yield, Test and Diagnostics session)

Anuradha Swaminathan, Intel Corporation 

ISTFA 2018 BEST STUDENT PAPER
“Pattern Search Automation for Combinational Logic Analysis”
(Emerging FA Techniques and Concepts session)

Venkat Ravikumar, Advanced Micro Devices


ISTFA 2018 BEST POSTER
Advanced T-LSIM System Detections using Amplified External Isolated Source-Sense Unit
Mr. Zhi Jie Lau, ON Semiconductor


ISTFA 2018 OUTSTANDING POSTER
OBIRCH for Isolating High and Low Resistance Test Structure Failures During Sub-14nm Technology Development
Dr. Felix Beaudoin, Globalfoundries Inc.

 

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