ITSC 2018: May 7-10 in Orlando, Florida
The conference and exposition will be held at the Gaylord Palms Resort & Convention Center. It is jointly organized by ASM Thermal Spray Society (TSS), the DVS - German Welding Society, and the International Institute of Welding (IIW).
Young Professionals Session
ITSC 2018 will again offer the young innovative scientists/professionals competition-based award and recognition program, seeking to encourage participation of young scientists in ITSC, and to provide attractive offers and opportunities in the worldwide thermal spray community. At the present time, we will consider abstract submissions based on the topics identified within the three symposia areas proposed for 2018.
ITSC 2018: Plan to Exhibit
- Face-to-face meetings with primary decisions makers and influencers
- Latest advances in thermal spray technology with new and expanding technical content
- Reach a targeted audience interested in reducing/control costs while improving their product
- Networking opportunities to strengthen and build relationships
- Face-to-face. It's the only way to do business. Plan now and reserve your space today!
Journal of Thermal Spray Technology Special Focus on Metal Additive Manufacturing
This special issue of the Journal of Thermal Spray Technology (JTST) includes selected papers on the emerging field of additive manufacturing (AM). This current issue includes five papers, with an additional two papers that appear in other regular issues.
Additive manufacturing refers to the various processes used to make three-dimensional parts by depositing material layer-by-layer from 3D computer-aided design models. This differs drastically from traditional manufacturing methods (TMM) such as subtractive (milling or drilling), formative (casting or forging), and joining (welding or fastening) processes. Additive manufacturing technologies include Vat photopolymerization, material extrusion, material jetting, binder jetting, powder bed fusion, direct energy deposition, and sheet lamination.
Click below for free access to the issue.