ASM Industry News
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Copper nanoparticle pastes bond copper plates into possible future electrodes
April 20, 2019
Scientists at Tohoku University in Japan report that they fabricated an electrode by printing copper nanoparticle-based nanopastes onto a glass substrate using a metal screen mask and pressureless sintering under a nitrogen atmosphere at 200 °C for 30 minutes.One Minute Mentor: Hardness of normalized ductile iron tempered at various temperatures
April 19, 2019
The normalizing temperature for ductile iron is usually between 870 and 940°C (1600 and 1725°F).WITec wins Scientists’ Choice Award for its inverted confocal Raman microscope
April 19, 2019
Witec, Germany, announces that its WITec alpha300 Ri inverted confocal Raman microscope has been honored by the worldwide readership of SelectScience.net with the Scientists’ Choice Award for Best New Product in the category of Spectroscopy.Leica user interface for DVM6 microscope cuts time for 2D/3D scanned image acquisition
April 19, 2019
Leica Microsystems, Buffalo Grove, Ill., introduces LAS X.next, the new streamlined software user interface for the DVM6 digital microscope.Brewer Science receives 2018 Preferred Quality Supplier Award from Intel
April 19, 2019
Brewer Science, Rolla, Mo., has been selected by Intel as a recipient of a 2018 Preferred Quality Supplier (PQS) award, which is recognition by Intel of companies that Intel believes “have relentlessly pursued excellence and conducted business with resolute professionalism.”Edax Velocity Super EBSD camera offers indexing performance up to 4500 points/sec
April 19, 2019
Edax Inc., Mahwah N.J., has added a new, faster, low-noise CMOS camera to its Velocity EBSD camera series, which now includes two cameras tailored to specific EBSD analysis applications.Zeiss 3D X-ray imaging solutions designed for semiconductor packaging failure analysis
April 19, 2019
Zeiss, Germany, announces a new suite of high-resolution 3D X-ray imaging solutions for failure analysis of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages.Siemens Mentor Graphics software selected by Boeing to enable next-gen design
April 19, 2019
Siemens, Plano, Texas, announces that Boeing has entered into an agreement to expand its use of Siemens’ Mentor Graphics software as part of its Second Century Enterprise Systems (2CES) initiative to transform itself, and the aerospace industry, to meet the challenges of the twenty-first century.Applied Materials receives Intel’s Preferred Quality Supplier Award for excellence
April 19, 2019
Applied Materials Inc., Santa Clara, Calif., has been selected as a recipient of an Intel 2018 Preferred Quality Supplier (PQS) award, which recognizes companies that Intel believes have “relentlessly pursued excellence and conducted business with resolute professionalism."2018 global semiconductor equipment sales jump to record $64.5 billion
April 19, 2019
SEMI, Milpitas, Calif., the industry association representing the worldwide electronics product design and manufacturing supply chain, reports that worldwide sales of semiconductor manufacturing equipment surged 14 percent from $56.62 billion in 2017 to an all-time high of $64.5 billion in 2018
