Tescan, Cranberry Township, Pa., will introduce the newest generation FESEM platform MAIA at the M&M show in Indianapolis in August. The instrument delivers high-resolution performance, ease-of-use by design, and throughput for the most challenging materials. It provides analytical and scanning mode flexibility without compromises.
Various chamber designs allow full customization for specific application requirements. MAIA excels at low voltage observation and related analysis, and incorporates numerous electron optical schemes contributing to outstanding low-voltage performance and flexibility down to 50 V.
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