Park Systems, Santa Clara, Calif., introduces Park NX-HDM, a fully automated atomic force microscopy (AFM) automatic defect review and sub-angstrom surface roughness measurement system for device substrates and disk media. The system increases throughput by up to 1000%, and offers a 30% higher success rate than prior systems. It analyzes, identifies, and scans media for all wafer sizes up to 150 mm.
“The Automatic Defect Review (ADR) speeds up and improves the way it identifies, scans, and analyzes defects in substrates and media,” comments Sang-il Park, CEO and Chairman. “Beta test runs with Park NX-HDM demonstrate a 10-fold increase in throughput for defect review in an automated process when compared with more traditional manual methods of defect review. Moreover, we perfected the remapping and defect identification algorithm, and the success rate of the new NX-HDM is 30% higher than its previous generation, XE-HDM.”
Park NX-HDM for HDD, LED, solar, and general semiconductor device industries, speeds up the automatic defect review for media and substrates. The survey scan, zoom-in scan, and analysis of imaged defect types are automated with wide range of automated optical inspection (AOI) tools.
In addition, True Non-Contact Mode™, combined with the industry’s lowest noise floor, provides accurate and reliable measurements for the sub-angstrom surface roughness of diverse media and substrates. The unique Park dual servo system with two symmetric, low-noise position sensors are incorporated on each axis of the XY scanner to retain a high scan orthogonality for wide scan ranges and sample sizes.
