Nordson DAGE, Aylsworth, U.K., a division of Nordson Corp., announces the launch of its Xi3400 Automated X-ray Inspection System (AXI). This system offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs, and packaged semiconductors. Ideal for in-line or off-line operation, the Xi3400’s algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.
The patented Digitial Tomosynthesis Technology enables the Xi3400 to acquire multiple images in different slice heights in one inspection cycle. The images can discriminate between components on the top and bottom slices of double sided boards for unimpeded automated inspection.
“The Xi3400 integrates the automation software techniques developed at Nordson YESTECH with Nordson DAGE hardware technology,” says Joshua Petras, Business Director – Inspection Products. “This new and improved AXI system expands the market-leading capabilities of our test and inspection portfolio.”
