Craic Technologies, San Dimas, Calif., introduces Craic FilmPro film thickness measurement software. This software package is designed to plug-in to CRAIC Technology’s microspectrophotometers and their controlling Lambdafire software. The software allows the user to measure the thickness of thin films rapidly and nondestructively. Able to analyze films of many materials on both transparent and opaque substrates, it enables the user to determine thin film thickness on everything from semiconductors, MEMS devices, and disk drives, to flat panel displays.
“Many of our customers want to measure the thickness of thin films of smaller and smaller sampling areas for rapid quality control of their products. Craic FilmPro is a plug-in module that can be added to a Craic microspectrophotometer to enable this capability. This software was built in response to customer requests for a powerful, flexible film thickness tool that can measure sub-micron areas on both transparent and opaque substrates,” says Dr. Paul Martin, President.
The complete microspot film thickness solution combines an advanced microspectrophotometer with the sophisticated FilmPro software. This software is a plug-in module to its Lambdafire instrument control software. It enables the user to measure film thickness by either transmission or reflectance of many types of materials and substrates.
Due to the flexibility of the design, sampling areas can range from over 100 microns across to less than a micron. Designed for both research and the production environment, it incorporates a number of easily modified processing recipes, the ability to create new film recipes, and sophisticated tools for analyzing data. With the addition of spectral mapping from Craic, film thickness maps of entire devices can be created.
