Quantum Focus Instrument Corp., Vista, Calif., introduces QuantumScope, a multi-sensor microscope optical head in which mid-wavelength infrared hot-spot detection, photoemission, and laser signal injection microscopy techniques are integrated into the same optical inspection platform. Engineers are now able to investigate semiconductor devices with all three primary optical FA techniques without moving between systems or changing set-up conditions.
The multi-sensor optical head of the QuantumScope allows inspection with multiple FA techniques on the same system, without moving the device or altering electrical biasing conditions. A single instrument configured with a multiple sensor microscope head can locate open lines, ohmic shorts, impedance issues, leakage currents, leaky capacitors, timing errors, oxide defects, resistive vias, latchup, ESD damage, and dynamic failures.
Semiconductor FA engineers generally talk of their investigation work in terms of seeking the root cause of failures on a device under test (DUT). Failure conditions often mimic operation of the DUT in real world applications. It can be a frustrating process for the engineer facing a DUT that has an elusive or intermittent defect. When an engineer is able to coax such a recalcitrant DUT into exhibiting the defect state under investigation, it becomes a race to determine the defect mechanisms involved before being forced to move the DUT to another type of inspection tool and start the investigation process all over.
Core system design concepts center on minimizing sample set-up time and maximizing data collection efficiency. The user sets up the device under test once. Then, various analytical techniques, sensors, optics, and software are engaged on the centric QuantumScope system. No time is lost to move the DUT to another instrument; biasing stability, and test conditions are preserved because the DUT stays in place. Single function microscopes are available with upgrade paths to additional techniques.
