FEI Co., Hillsboro, Oregon, announces that the latest technological innovations of the Helios G4 CX plasma-focused ion beam instrument, in combination with comprehensive software and FEI’s application expertise, allow Helios G4 CX with optional AS&V4 software to acquire the highest-quality multi-modal 3D datasets.
Combined with Avizo visualization software, it delivers a unique workflow solution for highest-resolution, advanced 3D characterization and analysis at the nanometer scale.
Helios G4 CX is part of the fourth generation of the Helios DualBeam family. It includes the Elstar electron column for ultra-high-resolution imaging and highest materials contrast. The Elstar is combined with the Tomahawk ion column for the fastest, easiest, and most precise high-quality sample preparation and 3D characterization, even on the most challenging samples.
The instrument combines the most complete sample information with sharp, refined, and charge-free contrast obtained from up to seven detectors that are integrated in-column and below-the-lens.
It allows the highest quality, multi-modal subsurface and 3D information with the most precise targeting of the region of interest using optional Auto Slice & View 4 (AS&V4) software.
It enables fast, accurate, and precise milling and deposition of complex structures with critical dimensions of less than 10 nm. Precise sample navigation is tailored to individual application needs thanks to the high-flexibility 110-mm stage and in-chamber Nav-Cam.
Artifact-free imaging is based on integrated sample cleanliness management and dedicated imaging modes such as SmartScan.
https://www.fei.com/products/dualbeam/Helios-G4-CX-for-Materials-Science/
