Maser Engineering, the Netherlands, announces that it has further strengthened its capabilities in semiconductor failure analysis by acquiring a second microwave-induced-plasma (MIP) decapsulation machine from Jiaco Instruments, also of the Netherlands.
Jiaco’s MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure MIP decapsulation utilizes oxygen gas-only recipes. The system has been proven for copper, palladium-copper, gold, and silver bond wires, and for advanced package types such as 3D, SiP, WLCSP, High Tg, Chip on Board, and BOAC. All have been processed without damage for reliable failure analysis and quality control.
Maser, which has been operating a Jiaco MIP decapsulation system since 2016, is an independent engineering service company. Since 1993, it has offered reliability testing and failure analysis services to the semiconductor and electronic systems industry.
“Maser has been a partner with Jiaco Instruments since the initial development of its machine,” says Kees Revenberg, Managing Director of Maser Engineering. “With the rapid advancement in semiconductor package technology, we will now be able to provide solutions for the most challenging failure analysis cases.”
