Spee3D, Australia, partnered with the Japan Ground Self-Defense Force (JGSDF) to introduce its innovative cold spray additive manufacturing (CSAM) technology to Japan. This contract with the Japan Ministry of Defense marks a significant milestone as the company continues to expand into the Asia-Pacific region.
The Japanese Self Defense Force will receive a WarpSPEE3D and a XSPEE3D. WarpSPEE3D is Spee3D’s first large-format metal 3D printer, able to produce large metal parts quickly in minutes or hours, offering a more cost-effective and scalable solution compared to traditional manufacturing methods. Its latest model, XSPEE3D, offers a robust, deployable metal additive manufacturing capability with SPEE3D’s patented cold spray 3D printing technology and auxiliary equipment integrated within one containerized shipping container unit. Enabling the opportunity to build metal parts on-site and on-demand in industries operating remotely, such as defense.
SPEE3D CEO, Byron Kennedy, says, “We are grateful for the opportunity to expand our presence into Japan and the APAC region. It is indeed an honor to collaborate with the Japanese military. Our aim is to train and prepare their forces to use the XSPEE3D printer in the field to address their most urgent supply chain issues through quickly manufactured on-demand parts.”
SPEE3D technology has already been used by various defense forces worldwide, including in field trials by the Australian, US, and UK militaries. With its technology, Japan’s self-defense forces now possess the unique capability to manufacture critical replacement parts in minutes or hours, on demand, in wide range of materials including but not limited to: Aluminum 6061, Aluminum Bronze, Copper, and Stainless Steel.
As part of the partnership, SPEE3D will provide the JGSDF comprehensive training, support, and maintenance for both WarpSPEE3D and XSPEE3D. This includes field exercise programs with the XSPEE3D, ensuring that Japan’s forces are well-equipped to fully utilize the potential of this technology when in the field and on base.
Image – Byron Kennedy, SPEE3D CEO (left) next to: Ground Staff Office Ministry of Defense Major General Mr. Shirakawa (right).
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