A $10 million programmatic increase at the Army Research Laboratory for rapid deposition research is anticipated to support cold spray engineering research at Florida International University.
Continue reading
Researchers at the University of Arizona in Tucson have developed a laser-based microscope that snaps images at attosecond — or a billionth of a billionth of a second — speed.
Continue reading
The U.S. National Science Foundation has selected Purdue Engineering-led Chipshub, West Lafayettes, Ind., as its Chip Design Hub by providing a $7 million grant over five years.
Continue reading
The University of the Philippines Diliman has formalized a PHP 3 million FA Hub partnership The SEM CALACA Power Corporation and the university’s Engineering Research and Development Foundation to consolidate failure analysis labs and launch industry focused services.
Continue reading
The Integrated Electronics Engineering Center at Binghamton University research that partners with industry to advance electronics manufacturing has been re-designated by New York state as a Center for Advanced Technology, receiving $1 million in annual funding for the next decade.
Continue reading
The University of North Texas, Denton, Texas, has partnered with Titomic Limited, Australia, the world’s leading provider of cold spray solutions, to install a customized Titomic Kinetic Fusion Cold Spray System.
Continue reading
Researchers on a team led by University of Michigan unveiled that phase separation, alongside oxygen diffusion, crucially supports the long-term retention of information in memristors, specifically in resistive random access memory.
Continue reading
Rice University students in Houston, Texas, have developed a cold spray metal 3D printing device that uses pressure and velocity instead of temperature, potentially expanding the capabilities and reducing the costs of metal additive manufacturing and repairing for complex, one-off parts.
Continue reading
The Midwest Microelectronics Consortium, a multi-state, regional initiative led by Ohio and dedicated to advancing the research and production of crucial microelectronics for the defense industry, was awarded regional hub designation and $24.3 million for FY 23 through the prestigious Microelectronics Commons program.
Continue readingThe U.S. National Science Foundation announced 24 research and education projects to 47 institutions with a total investment of $45.6 million — including funding from the “CHIPS and Science Act of 2022” — to enable rapid progress in new semiconductor technologies and manufacturing as well as workforce development.
Continue readingEngineering students around the world have just three months to take part in the global Valeo Innovation Challenge.
Continue reading
