ClassOne electroplating tool designed for 100 to 200-mm substrates
July 20, 2014 Source:
ClassOne Technology, Kalispell, Mont., has launched its Solstice line of electroplating tools designed specifically for 100 to 200-mm substrates. The plating equipment enables multiple types of metal deposition with chemical pre-wet, etch, rinse, and drying processes, all on a single-wafer automated system, and all driven by the long-proven Solaris controller on a Windows 7 platform. The result is state-of-the-art plating performance in a flexible, modern tool that's designed for smaller users and emerging technologies.
It is said to be the first automated plating tool that can deliver advanced performance on smaller substrates, at a price less than half that of equivalent 300mmtools from the large manufacturers.
"The bigger equipment companies have focused on building ever-smaller devices on ever-larger substrates," says ClassOne's VP of technology Kevin Witt. "They've been serving the market segment that buys expensive high-end tools — but they've left the cost-conscious people behind. Until now, the smaller-substrate users either had to buy used equipment or pay top dollar to get the big manufacturers to build them a 200mm-or-smaller plating tool."
The Solstice is available in two models. The fully automated cassette-to-cassette Solstice S8 provides up to eight process chambers for throughputs up to 75wph (wafers per hour), with system prices starting at $1m. The semi-automated Solstice LT features one or two chambers for development and pilot lines, with systems starting at $350,000. So, emerging technology users now have an affordable, scalable path from wet bench to volume production and higher return on investment.
ClassOne Technology, Kalispell, Mont., has launched its Solstice line of electroplating tools designed specifically for 100 to 200-mm substrates. The plating equipment enables multiple types of metal deposition with chemical pre-wet, etch, rinse, and drying processes, all on a single-wafer automated system, and all driven by the long-proven Solaris controller on a Windows 7 platform. The result is state-of-the-art plating performance in a flexible, modern tool that’s designed for smaller users and emerging technologies.
It is said to be the first automated plating tool that can deliver advanced performance on smaller substrates, at a price less than half that of equivalent 300mmtools from the large manufacturers.
“The bigger equipment companies have focused on building ever-smaller devices on ever-larger substrates,” says ClassOne’s VP of technology Kevin Witt. “They’ve been serving the market segment that buys expensive high-end tools — but they’ve left the cost-conscious people behind. Until now, the smaller-substrate users either had to buy used equipment or pay top dollar to get the big manufacturers to build them a 200mm-or-smaller plating tool.”
The Solstice is available in two models. The fully automated cassette-to-cassette Solstice S8 provides up to eight process chambers for throughputs up to 75wph (wafers per hour), with system prices starting at $1m. The semi-automated Solstice LT features one or two chambers for development and pilot lines, with systems starting at $350,000. So, emerging technology users now have an affordable, scalable path from wet bench to volume production and higher return on investment.
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