QuantumDiamonds deploys failure analysis technology at Taiwan semiconductor test house

Published: May 13, 2026

QuantumDiamonds GmbH, Germany, deployed its QDm.1 quantum sensing system at Integrated Service Technology (iST) in Taiwan, marking its first installation in Asia and a step toward adoption in high-volume semiconductor failure analysis.

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First quantum battery developed and tested by Australian researchers

Published: April 17, 2026

Australian scientists at the University of Melbourne have made a significant leap forward in energy storage technology by developing and testing the world’s first proof-of-concept quantum battery.

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Cosmic is born: A new global player for semiconductor test solutions – built on decades of experience

Published: April 17, 2026

Following an international expansion strategy initiated in 2022, a new global semiconductor test solutions group named Cosmic has been formed by uniting specialized industrial companies from Italy, the Netherlands, Germany, the United Kingdom, and the United States into two independent divisions: Cosmic Equipment and Cosmic Services.

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Uncovering hidden atomic patterns in semiconductors

Published: April 17, 2026

Advanced microscopy research at the US Department of Energy μ-ATOMS Energy Frontier Research Center reveals motifs of trace atoms in semiconductors, paving the way for new microelectronics designed atom by atom.

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New ZEISS Crossbeam 750 FIB-SEM for high-accuracy sample preparation workflows

Published: April 17, 2026

ZEISS, Germany, unveiled the Crossbeam 750 FIB-SEM for demanding sample preparation, providing a live “see while you mill” view to enable immediate feedback and uniform first-pass TEM lamellae without interruptions.

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Engineers create light-activated gel that boosts ion conductivity 400-fold

Published: April 17, 2026

MIT engineers have developed a soft, flexible gel that dramatically changes its conductivity upon the application of light, a development that could impact human-machine interfaces, biocompatible devices, soft robotics, and more.

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Electron microscopy shows ‘mouse bite’ defects in semiconductors

Published: March 18, 2026

Cornell researchers, Ithaca, N.Y., have used high-resolution 3D imaging to detect, for the first time, the atomic-scale defects in computer chips that can sabotage their performance using a new imaging technique called electron ptychography.

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Tiny thermometers offer on-chip temperature monitoring for processors

Published: March 18, 2026

Researchers at Penn State have developed a microscopic thermometer only one square micrometer across that can be integrated onto a chip to accurately track temperatures, using a new class of two-dimensional material known as bimetallic thiophosphates that had previously not been used in thermal sensors.

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Applied Materials accelerates chip defect review with next-gen eBeam system

Published: March 18, 2026

Applied Materials, Inc., Santa Clara, Calif., introduced a new defect review system to help semiconductor manufacturers continue pushing the limits of chip scaling combining the industry’s most sensitive electron beam technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale defects.

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Backblaze publishes 2025 Drive Stats Report: 13 years of data show a growing, healthier drive fleet

Published: March 18, 2026

Backblaze, Inc., San Mateo, Calif., published its 2025 Year-End Drive Stats report that analyzes the performance of 344,196 hard drives across 30 models and found the annual failure rate drops to 1.36% across 344,000+ drives and high-capacity models are on the rise as first 26TB drives enter service.

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