Duke researchers develop probes for bond testing of 3D integrated circuits

Published: April 19, 2015

Duke University, Durham, N.C., announces that its researchers have introduced probing solutions that may enable pre-bond and post-bond testing of through-silicon vias and logic dies used in manufacturing semiconductor components.

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Thin porous copper sheets transfer five times more heat from electronic devices

Published: April 19, 2015

Fujitsu Laboratories, Japan, has reportedly developed the world's first thin heat pipe designed for small electronic devices.

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Head of Mars Curiosity Rover Mission to speak at ASM’s Megashow

Published: March 26, 2015

SM International, Materials Park, Ohio, announced that Dr. John Grotzinger, chief scientist and head of strategic science planning for NASA's $2.5 billion Curiosity rover mission to Mars, was selected as the plenary speaker for their co-located show which takes place on May 11-14.

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Cypress and Spansion complete $5 billion merger

Published: March 19, 2015

Cypress Semiconductor Corp., San Jose, Calif., and Spansion Inc., Sunnyvale, Calif., have closed the merger of the two companies in an all-stock, tax-free transaction valued at approximately $5 billion.

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SEMI forecasts strong fab equipment spending in 2015

Published: March 18, 2015

SEMI, San Jose, Calif., has updated its SEMI World Fab Forecast outlooks for 2015 and 2016.

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Jeol’s fourth-gen AccuTOF-GCx offers higher resolution, accuracy, and sensitivity

Published: March 18, 2015

Jeol USA, Peabody, Mass., introduces the AccuTOF-GCx, the fourth generation of Jeol's successful gas chromatography/time-of-flight mass spectrometer systems.

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Craic adds circular polarization spectroscopy capabilities to its microspectrophotometers

Published: March 18, 2015

Craic Technologies, San Dimas, Calif., has added circular polarization spectroscopy capabilities to its microspectrophotometers.

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Bruker M2 Blizzard XRF is designed for NDT of printed circuit boards

Published: March 18, 2015

Bruker AXS Inc., Madison, Wis., introduces the M2 Blizzard, a small-spot X-ray fluorescence spectrometer specifically designed for the nondestructive analysis of printed circuit boards.

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Laser-based illumination module offers up to four times tilt alignment accuracy

Published: March 16, 2015

Ultra Tec Mfg. Inc., Santa Ana, Calif., introduces its Ultracollimator module for the Ultrapol Advance Precision lapping and polishing machine.

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Applied Materials and Tokyo Electron unveil new company name

Published: March 14, 2015

Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., announce that the name of their combined company is Eteris (ETERnal Innovation for Society).

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