Global Foundries and Imec partner for joint research on RF solutions for Internet of Things

Published: February 22, 2015

Global Foundries, Santa Clara, Calif., announces a partnership with Imec, Belgium, for joint research on future radio architectures and designs for highly integrated mobile devices and IoT applications.

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Intel reports record full-year unit shipments of PCs, servers, tablets, and phones

Published: February 22, 2015

Intel Corp., Santa Clara, Calif., reports record full-year unit shipments of PCs, servers, tablets, phones, and the Internet of Things; the company exceeded the tablet goal by shipping 46 million units.

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Craic UV-visible-NIR microspectrophotometer analyzes samples with high speed and accuracy

Published: February 22, 2015

Craic Technologies, San Dimas, Calif., introduces the Flex UV-visible-NIR microspectrophotometer, which is designed to be flexible in configuration, capabilities, and pricing.

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Semiconductor equipment industry posts $1.31 billion in January orders worldwide

Published: February 22, 2015

Semi, San Jose, Calif., reports that North America-based manufacturers of semiconductor equipment posted $1.31 billion in orders worldwide in January 2015.

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Edax atom probe assist tool speeds specimen preparation

Published: February 22, 2015

Edax Inc., Mahwah, N.J., has launched the Atom Probe Assist, a new tool designed to help users of atom probe tomography systems prepare specimens for faster and more efficient analysis than previously possible.

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Northwestern researchers evaluate silver nanowires for flexible electronics

Published: February 21, 2015

A research team at Northwestern University's McCormick School of Engineering, Evanston, Ill., has investigated the behavior of silver nanowires under cyclic loading to advance the understanding of how they might function in flexible electronics.

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Oxford Instruments to supply failure analysis systems to semiconductor company

Published: February 21, 2015

Oxford Instruments, England, announces that it has signed an agreement with one of the largest semiconductor companies in Europe to supply multiple failure analysis systems.

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Low-cost 50-cm long carbon nanotube composite fibers produced for flexible electronics

Published: February 18, 2015

Researchers from the Department of Materials Science and Engineering, Stanford University, have reportedly collaborated with researchers in China to produce polymer/carbon-nanotube composite fibers with lengths over 50 cm.

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Materion offers high strength copper foils for electronics

Published: February 18, 2015

Materion Performance Alloys, a Materion Corporation business, Mayfield Heights, Ohio, is preparing to meet increased demand for high-strength copper alloy strip products following the recent announcement by Mitsubishi Electric Co. that it will stop production of its copper alloy business effective March 2015.

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Antireflective backside coatings are NIR optimized with no baking

Published: February 18, 2015

Ultra Tec, Santa Ana, Calif., reports that its Arc-lite antireflective (AR) coating system coats package, board, and wafer level devices very rapidly, generally in less than one minute.

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