Advanced Semiconductor wins SEMI award for development of copper wire bonding

Published: January 19, 2015

Advanced Semiconductor Engineering Inc., Taiwan, announces that SEMI, the global micro- and nano-electronics industries association, has awarded ASE the 2014 SEMI Award for North America.

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Ultra Tec adds improved optics to ASAP-1 IPS for accurate tool positioning

Published: January 17, 2015

Ultra Tec Mfg. Inc., Santa Ana, Calif., announces that an improved machine-vision camera is now shipping with its ASAP-1 IPS units.

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Applied Materials collaborates with Samsung and PSK for advanced patterning

Published: January 17, 2015

Applied Materials Inc., Santa Clara, Calif., announces that it collaborated with Samsung Electronics Co. Ltd. and Korea's PSK Inc. to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

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Germanium replaces silicon in CMOS device

Published: January 17, 2015

Researchers at Purdue University, West Lafayette, Ind., have created the first modern complementary metal-oxide-semiconductor device in which germanium is the semiconductor instead of silicon.

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ESI laser drilling tool designed for semiconductor substrate fabrication

Published: January 17, 2015

Electro Scientific Industries Inc., Portland, Ore., introduces the CornerStone ICP Series 1 UV laser drilling system designed initially for integrated circuit packaging applications.

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Solar Atmospheres heat treats titanium manifold for Orion spacecraft

Published: January 07, 2015

Solar Atmospheres of Western Pennsylvania, Hermitage, Pa., announces that it vacuum heat-treated the titanium manifold in the Launch Abort System of the NASA Orion spacecraft launched in December.

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Coatings with air-filled aluminum oxide microspheres protect turbines

Published: January 05, 2015

Researchers at Fraunhofer ICT, Germany, have developed a coating in which air-filled aluminum oxide microspheres protect against heat and oxidation.

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Fine-pitch copper pillar flip chip enables lower cost, green compliance

Published: December 12, 2014

Amkor Copper, Chandler, Ariz., has available a copper pillar bump flip chip interconnect, which offers advantages in many designs while meeting current and future ROHS requirements.

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RF transistors made of films of black phosphorus

Published: December 12, 2014

Researchers at the University of Southern California, Los Angeles, have shown that films of black phosphorus can be used to make radio-frequency transistors, components found in many telecommunication devices.

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CoorsTek to acquire Covalent Materials Corporation

Published: December 12, 2014

CoorsTek Inc., Golden, Colo., has reached a definitive agreement with the Carlyle Group and Unison Capital Group to acquire Covalent Materials Corp., Japan.

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