Software enables sub-micron spatial resolution for microspectrophotometers

Published: November 23, 2014

Craic Technologies, San Dimas, Calif., announces Spectral Surface Mapping (S2M) software for its UV-visible-NIR microspectrophotometers.

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ESI announces versatile laser micromachining platform

Published: November 23, 2014

Electro Scientific Industries Inc., Portland, Maine, announces the µFlex Series multi-axis precision laser micromachining platform.

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Applied Materials develops advanced patterning solution for memory devices

Published: November 23, 2014

Applied Materials Inc., Santa Clara, Calif., announces that it has collaborated with Samsung Electronics Co. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

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Imec, Coventor partner to advance CMOS process development

Published: November 23, 2014

Imec, Belgium, has announced a joint development project with Coventor, Cary, N.C., that will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to Imec's 10- and 7-nm processes.

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Qualcomm joins SRC’s Trustworthy and Secure Semiconductors and Systems initiative

Published: November 23, 2014

Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Inc., has joined SRC's Trustworthy and Secure Semiconductors and Systems (T3S) program.

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Bruker microtomography system images complete internal structure

Published: November 23, 2014

Bruker microCT, Belgium, introduces the SkyScan 1172, a high-resolution desktop microtomography (micro-CT) system for 3D nondestructive X-ray imaging of an object's internal microstructure.

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Semiconductor sales in September increase by 8% over last year

Published: November 23, 2014

The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $87 billion during the third quarter of 2014, an increase of 5.7% over the previous quarter and a jump of 8% compared to the third quarter of 2013.

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Applied Materials and Tokyo Electron select new company name

Published: November 22, 2014

Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., have released the new name and logo of their combined company: Eteris.

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Stratasys announces triple-jetting technology for faster additive manufacturing

Published: November 10, 2014

Stratasys, Minneapolis, announces that triple-jetting technology is now available cross-platform, providing up to 20% faster fused-deposition-modeling production.

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Optomec announces record orders for 3D printers

Published: November 10, 2014

Optomec, Albuquerque, N.M., announces that its order bookings have more than doubled through the first three quarters of 2014.

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