New thermal management technology for electronic devices reduces bulk while improving cooling

Published: June 15, 2022

A team from the University of Illinois at Urbana-Champaign , Ill., and UC Berkeley, Calif., published a paper in Nature Electronics detailing a new cooling method that offers a host of benefits, not the least of which is space efficiency that offers a substantial increase over conventional approaches in devices’ power per unit volume.

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Skyrmions on the rise – new 2D material advances low-power computing

Published: June 15, 2022

Researchers at Lawrence Berkeley National Laboratory, UC Berkeley, Cornell, and Rutgers University have discovered layered 2D materials that can host unique magnetic features that remain stable at room temperature and could thus eventually be used in future everyday devices.

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Light-emitting electrochemical cells for recyclable lighting

Published: May 19, 2022

Researchers at the Technical University of Munich in Germany and the University of Turin in Italy used extensive data analysis to create first-class electrochemical cells from copper complexes that emit blue and white light.

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New imaging method makes microrobots visible in the body

Published: May 19, 2022

Researchers at the Max Planck ETH Center for Learning Systems, Germany, have developed an imaging technique that for the first time recognizes cell-sized microrobots individually and at high resolution in a living organism.

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New laser-based volumetric additive manufacturing method can 3D print glass in seconds

Published: May 19, 2022

Researchers at Lawrence Livermore National Laboratory and the University of California, Berkeley demonstrated the ability to 3D-print microscopic objects in silica glass through volumetric additive manufacturing, part of an effort to produce delicate, layer-less optics that can be built in seconds or minutes.

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Henkel opens new technical application center in Silicon Valley to foster next-generation electronics development

Published: May 19, 2022

Henkel today announced the opening of its Application Center in Santa Clara, Calif., designed to support product development for the company’s high-tech customers in the Silicon Valley region.

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Ansys supports high-speed digital engineering through new graduate program

Published: May 19, 2022

The University of Colorado Boulder will launch a master’s degree program that will integrate and feature Ansys’ best-in-class electronics simulation in its new Professional Master’s Program in high-speed digital engineering.

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SZX-AR1 augmented reality system simplifies microscope-based manufacturing

Published: May 19, 2022

Evident, Japan, released its SZX-AR1 augmented reality system that retrofits to existing Olympus SZX series stereo microscopes to simplify complex microscope-based manufacturing tasks and simplify assembler training.

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Quality versus emergency: How good were ventilation fittings produced by additive manufacturing to address shortages during the COVID-19 pandemic?

Published: May 11, 2022

In a study published in PLoS One, researchers from hospitals and companies in France assessed five 3D-printed fittings with and without coatings over a period of 18 months and provide key elements towards better quality control of 3D-printed ventilation fittings in a context of sanitary crisis.

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NWE answers why the Hebgen Dam failure occurred and how it is being addressed

Published: May 11, 2022

NorthWestern Energy discussed the Hebgen Dam failure at its annual Discussion of Madison River Topics meeting in Ennis, Montana.

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