Copper sensors are cheap, light, flexible, and highly conductive

Published: August 24, 2014

Researchers at Monash University, Melbourne, Australia, have developed a cost-effective way of making flexible copper conductors for commercial applications.

News, Magazine & Media / Industry News

Asylum Research receives award for AFM blue laser excitation capability

Published: August 24, 2014

Oxford Instruments Asylum Research, Santa Barbara, Calif., has received the 2014 Microscopy Today Innovation Award for the development of blueDrive Photothermal Excitation.

News, Magazine & Media / Industry News

Hysitron receives R&D 100 award for system to test materials in extreme environments

Published: July 30, 2014

Hysitron Inc., Minneapolis, Minn., has received an R&D 100 Award for its xSol high-temperature stage, which enables high-resolution nanomechanical measurements over a broad temperature and humidity range.

News, Magazine & Media / Industry News

Porous silicon oxide enables high-density computer memory

Published: July 21, 2014

Rice University, Houston, announces that its breakthrough silicon oxide technology for high-density, next-generation computer memory is one step closer to mass production, thanks to a refinement that will allow manufacturers to fabricate devices at room temperature with conventional production methods.

News, Magazine & Media / Industry News

Hybrid microscope combines confocal-scanning-laser and full-color-confocal microscopes

Published: July 21, 2014

Lasertec, Japan, introduces its Optelics Hybrid microscope, which combines a confocal scanning laser microscope with a full color confocal microscope.

News, Magazine & Media / Industry News

Oxford Instruments Asylum Research opens AFM demo lab in Mumbai

Published: July 20, 2014

Oxford Instruments Asylum Research, Santa Barbara, Calif., announces the opening of its first Nanotechnology Lab for Atomic Force Microscopy (AFM) in Mumbai, India.

News, Magazine & Media / Industry News

ClassOne electroplating tool designed for 100 to 200-mm substrates

Published: July 20, 2014

ClassOne Technology, Kalispell, Mont., has launched its Solstice line of electroplating tools designed specifically for 100 to 200-mm substrates.

News, Magazine & Media / Industry News

SUSS MicroTec launches ELD 300 excimer laser debonder for 3D integration

Published: July 20, 2014

SÜSS MicroTec, Germany, has launched an excimer laser debonder, the ELD300, for the stress-free debonding of 200 and 300-mm 3D-IC wafers.

News, Magazine & Media / Industry News

Power Electronics Manufacturing Consortium to develop silicon carbide electronic devices

Published: July 20, 2014

New York State and more than 100 companies, led by General Electric, Schenectady, N.Y., will collaborate to launch the New York Power Electronics Manufacturing Consortium at the SUNY College of Nanoscale Science and Engineering in Albany.

News, Magazine & Media / Industry News

AFM with automated defect review of bare wafers increases production throughput by 1000%

Published: July 20, 2014

Park Systems, Santa Clara, Calif., announces Park NX-Wafer, an AFM designed for bare wafer manufacturing that fully automates the automatic defect review process.

News, Magazine & Media / Industry News