A deeper understanding of molecular vibrations can increase electron velocity in semiconductor materials

Published: March 18, 2021

Researchers at the Institut national de la recherche scientifique (INRS), Canada and the University of Strasbourg, France, demonstrated the role played by molecular vibrations on electron conductivity on crystals in molecules that can conduct electricity, paving the way for developing even more efficient materials for electronics.

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New material always expands regardless if compressed or strained

Published: March 18, 2021

Researchers at Universität Dresden, Germany have discovered a new two-dimensional material with unprecedented properties: regardless if it is strained or compressed, it always expands.

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Researchers create a new transistor based on metal nanoparticles and ionic gradients

Published: March 18, 2021

Researchers at Northwestern Polytechnical University, China, the National Center for Nanoscience and Technology, China, and other Chinese institutes introduced a new design strategy to create transistors and logic circuits with tunable electrical conductivity based on metal nanoparticles.

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New Applied Materials tools use AI to catch mistakes on chips

Published: March 18, 2021

A new semiconductor manufacturing technology from Applied Materials, San Francisco, Calif., uses artificial intelligence, or AI, to spot mistakes in chips more effectively.

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Engineers 3D print a miniaturized spectrometer

Published: February 19, 2021

Scientists of the University of Stuttgart, Germany, developed a 3D-printed miniature spectrometer that can be manufactured directly onto camera sensors or arranged for quick ("snapshot") and low-profile, highly customizable hyperspectral cameras.

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Researchers design next-generation photodetector

Published: February 19, 2021

Researchers at Northwestern University, Evanston, Ill., have developed a new approach to quantum device design that has produced the first gain-based long-wavelength infrared (LWIR) photodetector using band structure engineering based on a type-II superlattice material.

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Lam Research advances next generation 3D memory manufacturing with new Vantex etch technology

Published: February 19, 2021

Lam Research Corp., Fremont, Calif, announced Vantex, the latest in dielectric etch technology designed specifically for Sense.i, the most intelligent etch platform available today.

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Oxford Instruments Plasma Technology relocates to advanced manufacturing facility

Published: February 19, 2021

Oxford Instruments Plasma Technology, UK, a leading provider of advanced wafer processing solutions for the semiconductor industry, announced plans to move to a state-of-the-art, manufacturing facility in Bristol, UK.

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Exploring unknown environments with ultrasound

Published: February 19, 2021

Researchers at the Phoenix project at Eindhoven University of Technology, Netherlands, developed a swarm of sensor nodes to explore unknown environments that are difficult for humans to access, like underground liquid-filled environments such as deep oil wells or water distribution systems.

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Qualcomm CEO elect says Huawei ban may help with chip shortages

Published: February 19, 2021

Incoming Chief Executive Officer Cristiano Amon at Qualcomm Inc., San Diego, said U.S. sanctions against China’s Huawei Technologies Co. may help alleviate a global shortfall in semiconductor supply.

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