ASM International Publishes Digital-First Articles from Failure Analysis and Prevention Handbook

Published: December 15, 2020

ASM International publishes digital-first articles from the new edition of Failure Analysis and Prevention Handbook.

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International Symposium for Testing and Failure Analysis Conference Proceedings Added to ASM Digital Library

Published: December 10, 2020

The Electronic Device Failure Analysis Society (EDFAS), an affiliate society of ASM International, is proud to announce the launch of the new ISTFA Proceedings site in the ASM Digital Library. The new site provides convenient access to conference papers from the renowned International Symposium for Testing and Failure Analysis annual event.

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Nikon Metrology and NSI Microscopy Inspection Automation form new partnership

Published: December 09, 2020

Nikon Metrology, Brighton, Mich., announced a new partnership with NSI Microscopy Inspection Automation of Wexford, Ireland.

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A new platform for exploring blended materials along compositional gradients

Published: December 09, 2020

A team from the U.S. Department of Energy’s Brookhaven National Laboratory (Upton, NY), Yale University (New Haven, CT), and University of Pennsylvania (Philadelphia, PA), built a first-of-its-kind automated electrospray deposition tool for depositing films with finely controlled blend compositions made of up to three components onto single samples.

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AMD to acquire Xilinx, creating the industry’s high performance computing leader

Published: December 09, 2020

Advanced Micro Devices Inc. (Silicon Valley, Calif.) and Xilinx Inc. (San Jose, Calif.) announced they have entered into a definitive agreement for AMD to acquire Xilinx in an all-stock transaction valued at $35 billion.

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Liquid metals produce ultrathin semiconductors with no grain boundaries

Published: December 09, 2020

Researchers at the University of New South Wales’ School of Chemical Engineering, Sydney, Australia, have developed a new approach to deposit large scale ultrathin semiconductors without grain boundaries using liquid metals.

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GlobalFoundries and Soitec announce RF-SOI wafer supply agreement driven by accelerating demand for 5G RF solutions

Published: December 09, 2020

GlobalFoundries, Santa Clara, Calif., and Soitec, Paris, announce a multi-year supply agreement for 300mm radio frequency silicon-on-insulator wafers.

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UAH researchers develop new atomic layer deposition process using ultrasonics

Published: December 09, 2020

Researchers at the University of Alabama in Huntsville invented a new way to deposit thin layers of atoms as a coating onto a substrate material at near room temperatures.

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Optimized analysis tools provide solution for complex weld inspections

Published: November 24, 2020

Olympus, Waltham, Mass., released its WeldSight companion PC software for the OmniScan X3 phased array flaw detector, which provides inspectors with powerful tools to push the boundaries of flaw characterization and sizing.

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Leco adds hydrogen to the 828 series

Published: November 17, 2020

Leco Corporation, St. Joseph, Mich., announces the addition of hydrogen analysis capabilities to the 828 series, which will transform the way users determine carbon, hydrogen, and nitrogen in a variety of petrochemical and other organic materials.

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